MAX3222ECUP Integrated Circuit Chip 15kV ESD-Protected, Down to 10nA, True RS-232 Transceiver

±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V, Up to 1Mbps, True RS-232 Transceivers

General Description

The MAX3222E/MAX3232E/MAX3237E/MAX3241E/ MAX3246E +3.0V-powered EIA/TIA-232 and V.28/V.24 communications interface devices feature low power consumption, high data-rate capabilities, and enhanced electrostatic-discharge (ESD) protection. The enhanced ESD structure protects all transmitter outputs and receiver inputs to ±15kV using IEC 1000-4-2 Air-Gap Discharge, ±8kV using IEC 1000-4-2 Contact Discharge (±9kV for MAX3246E), and ±15kV using the Human Body Model. The logic and receiver I/O pins of the MAX3237E are protected to the above standards, while the transmitter output pins are protected to ±15kV using the Human Body Model.

A proprietary low-dropout transmitter output stage delivers true RS-232 performance from a +3.0V to +5.5V power supply, using an internal dual charge pump. The charge pump requires only four small 0.1µF capacitors for operation from a +3.3V supply. Each device guarantees operation at data rates of 250kbps while maintaining RS-232 output levels. The MAX3237E guarantees operation at 250kbps in the normal operating mode and 1Mbps in the MegaBaud™ operating mode, while maintaining RS-232- compliant output levels.

The MAX3222E/MAX3232E have two receivers and two transmitters. The MAX3222E features a 1µA shutdown mode that reduces power consumption in battery-powered portable systems. The MAX3222E receivers remain active in shutdown mode, allowing monitoring of external devices while consuming only 1µA of supply current. The MAX3222E and MAX3232E are pin, package, and functionally compatible with the industry-standard MAX242 and MAX232, respectively.

The MAX3241E/MAX3246E are complete serial ports (three drivers/five receivers) designed for notebook and subnotebook computers. The MAX3237E (five drivers/ three receivers) is ideal for peripheral applications that require fast data transfer. These devices feature a shutdown mode in which all receivers remain active, while consuming only 1µA (MAX3241E/MAX3246E) or 10nA (MAX3237E).

The MAX3222E, MAX3232E, and MAX3241E are available in space-saving SO, SSOP, TQFN and TSSOP packages. The MAX3237E is offered in an SSOP package. The MAX3246E is offered in the ultra-small 6 x 6 UCSP™ package.

Applications

Battery-Powered Equipment    Printers

Cell Phones                             Smart Phones

Cell-Phone Data Cables          xDSL Modems

Notebook, Subnotebook,

and Palmtop Computers

Next-Generation Device Features

♦ For Space-Constrained Applications MAX3228E/MAX3229E: ±15kV ESD-Protected, +2.5V to +5.5V, RS-232 Transceivers in UCSP

♦ For Low-Voltage or Data Cable Applications MAX3380E/MAX3381E: +2.35V to +5.5V, 1µA, 2Tx/2Rx, RS-232 Transceivers with ±15kV ESD-Protected I/O and Logic Pins

ABSOLUTE MAXIMUM RATINGS

V_CC to GND..............................................................-0.3V to +6V

V+ to GND (Note 1)..................................................-0.3V to +7V

V- to GND (Note 1) ...................................................+0.3V to -7V

V+ + |V-| (Note 1).................................................................+13V

Input Voltages

    T_IN, EN, SHDN, MBAUD to GND ........................-0.3V to +6V

    R_IN to GND .....................................................................±25V

Output Voltages

    T_OUT to GND...............................................................±13.2V

    R_OUT, R_OUTB (MAX3241E)................-0.3V to (V_CC + 0.3V)

Short-Circuit Duration, T_OUT to GND.......................Continuous

Continuous Power Dissipation (TA = +70°C)

    16-Pin SSOP (derate 7.14mW/°C above +70°C) ..........571mW

    16-Pin TSSOP (derate 9.4mW/°C above +70°C) .......754.7mW

    16-Pin TQFN (derate 20.8mW/°C above +70°C) .....1666.7mW

    16-Pin Wide SO (derate 9.52mW/°C above +70°C) .....762mW

    18-Pin Wide SO (derate 9.52mW/°C above +70°C) .....762mW

    18-Pin PDIP (derate 11.11mW/°C above +70°C)..........889mW

    20-Pin TQFN (derate 21.3mW/°C above +70°C) ........1702mW

    20-Pin TSSOP (derate 10.9mW/°C above +70°C) ........879mW

    20-Pin SSOP (derate 8.00mW/°C above +70°C) ..........640mW

    28-Pin SSOP (derate 9.52mW/°C above +70°C) ..........762mW

    28-Pin Wide SO (derate 12.50mW/°C above +70°C)............1W

    28-Pin TSSOP (derate 12.8mW/°C above +70°C) ......1026mW

    32-Lead Thin QFN (derate 33.3mW/°C above +70°C)..2666mW

    6 x 6 UCSP (derate 12.6mW/°C above +70°C).............1010mW

Operating Temperature Ranges

    MAX32_ _EC_ _ ...................................................0°C to +70°C

    MAX32_ _EE_ _.................................................-40°C to +85°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Bump Reflow Temperature (Note 2)

    Infrared, 15s..................................................................+200°C

    Vapor Phase, 20s..........................................................+215°C

Note 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.

Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not allowed.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

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